SEMCNS Co., Ltd.
KKRX:25299015,490.00
KRW
+340.00
(+2.24%)
ISIN
KR7252990007
Return %
Stock
S&P 500
1Y
126.13
14.39
3Y
213.25
81.42
5Y
136.49
68.62
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Yu-Jin Choi
- Full Time Employees
- 307
- Sector
- Producer manufacturing
- Industry
- Electrical products
- Address
- Seongnam-si South Korea
- IPO Date
- May 20, 2021
- Website
- semcns.com
- Similar Companies
- Business
- SEMCNS Co., Ltd. is a South Korea-based semiconductor component manufacturing company primarily engaged in the development, fabrication, and distribution of advanced ceramic space transformers utilized in semiconductor test probe cards. Founded in 2016 following the spin-off and acquisition of Samsung Electro-Mechanics' ceramic space transformer business unit, the company operates as a core affiliate of the YIK-Exicon Group and maintains its headquarters in Seongnam-si, Gyeonggi-do, South Korea. SEMCNS specializes in multi-layer ceramic technology that serves as a critical spatial interconnect substrate between microscopic semiconductor wafer contact pads and printed circuit boards during electrical wafer-level probing and sorting. The company's core product and service portfolio comprises: NAND Flash Ceramic Space Transformers (STF), providing high-density, multi-layer co-fired ceramic substrates for high-stack NAND memory test probe cards; DRAM Ceramic Space Transformers (STF), engineered with ultra-fine pitch interconnects and high signal integrity for dynamic random-access memory wafer testing; Non-Memory and Logic Ceramic Space Transformers (STF), tailored for CMOS image sensors (CIS), display driver ICs (DDI), power management ICs, and micro-controller units; Advanced Packaging and AI Memory Testing Substrates, customized for High Bandwidth Memory (HBM) probe cards and multi-chip module testing; and Advanced Ceramic Material Solutions, encompassing proprietary low-temperature co-fired ceramic (LTCC) and high-temperature co-fired ceramic (HTCC) formulations, high-precision via-hole processing, thin-film surface metallization, and customized substrate fabrication services. SEMCNS distributes its products to major semiconductor integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) vendors, and commercial probe card manufacturers across South Korea, Taiwan, China, the United States, and Japan. In recent developments, SEMCNS has accelerated strategic expansions into advanced packaging and AI memory testing to diversify its operational base beyond traditional memory segments. The company has completed development and commercial qualification of next-generation ceramic STFs optimized for High Bandwidth Memory (HBM3e and HBM4) wafer probe cards to meet demand from leading artificial intelligence semiconductor manufacturers. Additionally, SEMCNS has expanded its manufacturing capacity and cleanroom facilities at its Osan production site to scale volume output for high-precision DRAM and logic substrates. To support next-generation semiconductor packaging roadmaps, the company has also initiated advanced R&D projects and strategic development partnerships focused on glass core substrate (Glass STF) technologies for ultra-fine pitch, high-frequency computing applications while broadening its direct customer engagements with global tier-one semiconductor fabricators.