NEXTIN, Inc. provides advanced defect inspection and metrology solutions crucial for the global semiconductor and display industries. The company delivers its core offerings to facilitate precise quality control across complex manufacturing sequences. Among its key products, the AEGIS wafer inspection systems employ innovative 2D imaging to identify diverse 1x-nm node processing defects, including bridges, thinning, and particles, throughout film, pattern-generation, and cleaning stages for 200mm and 300mm wafers, utilizing AI for defect classification. The IRIS metrology-inspection platform addresses 3D semiconductor device manufacturing by measuring vertical structures and detecting pattern flaws during high aspect ratio (HAR) processes and Through Silicon Via (TSV) advanced packaging. Furthermore, the KROKY inspection system incorporates advanced 2D and 3D imaging, specializing in front-end and advanced packaging processes like HBM stacking and hybrid bonding, with AI-driven defect classification and infrared capabilities to detect submicron defects and lateral cracks at high speeds. Complementing these, the TWINS integration module directly attaches to process equipment to monitor edge trimming and inspect related defects in real-time. NEXTIN's proprietary technologies aim to enhance early process stabilization, improve fabrication yields, and offer a cost-effective alternative in the dark field inspection market. Established in 2010, the company maintains its headquarters in Hwaseong-si, South Korea, with an R&D center in Israel to support its global clientele.