HBL Corporation
KKRX:4521904,480.00
KRW
-100.00
(-2.18%)
ISIN
KR7452190002
Return %
Stock
S&P 500
1Y
-6.37
14.39
3Y
- -
81.42
5Y
- -
68.62
Capital Structure
KRW
•
in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
KRW
•
in mil. unless spec.Quarterly Dividends Per Share
KRW
•
in mil. unless spec.Company Description
- CEO
- Jung-Mook Kim
- Full Time Employees
- 83
- Sector
- Electronic technology
- Industry
- Electronic equipment/Instruments
- Address
- Daejeon South Korea
- IPO Date
- Jan 4, 2024
- Website
- hblaser.co.kr
- Similar Companies
- Business
- HBL Corporation, formerly known as Hanbit Laser Co., Ltd., is a South Korea-based industrial technology company specializing in the design, engineering, and manufacturing of high-precision industrial laser processing equipment, optical automation systems, and smart factory manufacturing solutions. Founded in 1997 and headquartered in Daejeon, South Korea, the company provides mission-critical laser application systems to global manufacturers operating across the secondary battery, electric vehicle, semiconductor, electronics, and automotive industries. The company organizes its operations across key industrial application segments and offers a comprehensive portfolio of products and services: secondary battery manufacturing solutions, comprising automated laser cell-tracking marking systems, vision-integrated high-speed battery tab welding systems, laser surface cleaning and coating ablation equipment, precision battery electrode notching systems, and high-efficiency series-type charge-discharge systems for battery cell activation and formation; automotive and electric vehicle equipment, comprising industrial laser Vehicle Identification Number (VIN) marking systems, robotic three-dimensional remote welding systems (RWS), powertrain component processing machinery, and automated laser welding solutions for electric vehicle battery busbars and wire harnesses; semiconductor and advanced packaging systems, comprising Through-Glass Via (TGV) laser drilling and glass substrate scribing and cutting machinery for next-generation artificial intelligence semiconductor packaging, flexible printed circuit board (FPCB) and PCB laser cutting tools, and lead frame trimming and marking equipment; and general laser and automation systems, comprising fiber, ultraviolet (UV), green, and carbon dioxide (CO2) laser source modules, automated robotic cutting and welding cells, integrated machine vision inspection systems, laser engraving machinery, and customized turnkey factory automation engineering and maintenance services. In recent strategic developments, HBL Corporation completed its public listing on the KOSDAQ market of the Korea Exchange (Ticker: KRX:452190) via a merger with DB Financial No. 10 SPAC. The company has since accelerated its expansion into advanced semiconductor packaging by commercializing proprietary laser drilling and substrate-cutting systems optimized for glass-core AI substrates. Additionally, HBL Corporation broadened its clean-energy portfolio beyond welding and marking by rolling out localized series formation and cycling equipment for battery cell activation, while initiating a major facility expansion in Daejeon designed to increase its annual production capacity up to KRW 500 billion to fulfill escalating domestic and international order demand.