Lasertec Corp.

Lasertec Corp.

214.00
EUR
-8.00
(-3.60%)
Oct 30Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
150.9
168.43
169.57
191.6
235.67
319.03
472.1
779
1,002.2
1,694.69
2,367.39
2,788.34
- -
- -
Basic EPS, GAAP
21.84
32.76
35.79
39.2
48.42
65.8
120.02
213.47
275.56
511.89
655.04
938.61
- -
- -
Free Cash Flow per Basic Share
42.57
10.53
30.1
31.97
24.75
53.79
162.88
75.96
-97.88
221.8
330.26
837.7
- -
- -
Dividend per Share
6
6.75
11.5
12.75
20
19
31
47
86.99
117
201
272
- -
- -
Book Value per Share
193.67
221.92
241.83
271.45
300
344.96
434.43
611.99
806.66
1,210.22
1,677.78
2,327.28
- -
2,516.56
Tangible Book Value per Share
193.66
221.56
241.29
269.53
294.07
339.83
425.07
577.95
740.61
1,141.87
1,630.71
2,300.1
- -
2,496.61
Basic Weighted Avg Shares
90
90
90
90
90
90
90
90
90
90
90
90
90
90
Sales/Revenue/Turnover
13,607
15,188
15,292
17,278
21,252
28,770
42,573
70,248
90,378
152,832
213,506
251,477
- -
- -
Operating Margin (%)
22.76
31.1
28.96
28.37
26.75
27.6
35.38
37.12
35.95
40.76
38.11
48.85
- -
- -
Depreciation Expense
234
227
272
419
558
500
881
1,643
3,483
3,486
4,726
4,676
- -
- -
Net Income, GAAP
1,969
2,954
3,228
3,535
4,366
5,934
10,824
19,250
24,850
46,164
59,076
84,652
- -
- -
Effective Tax Rate (%)
36.47
36.32
29.45
28.8
23.49
24.26
28.39
27.19
26
27.49
27.97
29.13
- -
- -
Profit Margin (%)
14.47
19.45
21.11
20.46
20.55
20.63
25.42
27.4
27.5
30.21
27.67
33.66
- -
- -
Working Capital
10,307
12,877
14,960
16,390
18,608
21,408
27,944
38,741
55,864
69,652
113,694
168,942
- -
186,707
LT Debt
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Total Equity
17,463
20,011
21,808
24,479
27,054
31,108
39,176
55,188
72,745
109,142
151,315
209,898
- -
225,561
Return on Invested Capital (%)
11.04
15.36
14.32
14.53
16.42
19.98
28.27
36.63
32.65
41.55
39.44
43.18
- -
- -
Return on Capital (%)
11.47
15.77
15.44
15.27
16.95
20.41
30.8
40.8
36.03
46.91
44.51
46.88
- -
- -
Return on Common Equity (%)
11.83
15.76
15.44
15.27
16.95
20.41
30.8
40.8
38.85
50.76
45.36
46.87
- -
- -

Capital Structure

JPY

•

in mil. unless spec.
Jun'25
Sep'26
Dec'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
90
90
90
Market Capitalization
- -
- -
- -

Working Capital

JPY

•

in mil. unless spec.
Jun'25
Sep'26
Dec'26
Total Current Assets
286,861
- -
268,553
Cash, Cash Equivalents & STI
86,087
- -
80,500
Accounts Receivable, Net
24,790
- -
19,758
Inventories
169,005
- -
161,838
Total Current Liabilities
117,919
- -
81,846
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
- -
Free Cash Flow
- -
- -
- -
Net Income, GAAP
- -
- -
- -
Sales/Revenue/Turnover
- -
- -
- -
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
47,305
47,684
62,213
56,304
213,506
2025
- -
- -
- -
- -
251,477
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
85.4
160.73
214.25
194.65
655.04
2025
- -
- -
- -
- -
938.61
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
128
- -
73
- -
201
2025
- -
- -
- -
- -
272
2026
- -
- -
- -
- -
- -

Company Description

CEO
Tetsuya Sendoda
Full Time Employees
1,335
Sector
Electronic technology
Industry
Electronic equipment/Instruments
Address
2-10-1 Shin-yokohama Yokohama KN Japan 222-8552
IPO Date
Dec 25, 1990
Business
Lasertec Corporation is a Tokyo-based company founded in 1965, specializing in the manufacturing and sale of advanced inspection and measurement systems primarily for the semiconductor and flat panel display (FPD) industries. Its core product portfolio includes photomask inspection systems essential for semiconductor fabrication; overlay and critical dimension (CD) measurement systems; defect review and metrology tools for integrated circuits and MEMS (Micro-Electro-Mechanical Systems); laser microscopes for detailed surface observation; and FPD inspection equipment. The company also provides maintenance and upgrade services supporting these semiconductor manufacturing tools. Lasertec operates globally, serving major semiconductor manufacturers and advanced electronics producers. In the past 1-2 years, Lasertec has pursued strategic initiatives such as expanding its technology offerings and strengthening global customer engagement. Notable developments include launching next-generation inspection systems with enhanced accuracy and throughput, securing new partnerships to broaden its semiconductor value chain reach, and reinforcing research and development efforts focused on next-wave semiconductor manufacturing technologies. The company reported robust financial growth driven by heightened demand for semiconductor fabrication equipment amid a cyclical industry expansion and has been recognized for its high growth in the Asia-Pacific region in 2024. Lasertec’s business strategy focuses on staying at the forefront of inspection technologies critical to advanced semiconductor node manufacturing and evolving electronic component markets. Lasertec serves the semiconductor manufacturing sector, including customers involved in IC and MEMS fabrication, as well as the flat panel display industry. Its systems are integral to maintaining high yield and quality control in semiconductor fabs worldwide. The company’s operations span Asia, the Americas, and Europe, leveraging strong technical expertise in laser-based measurement and image processing technologies. It remains an independent company publicly traded on the Tokyo Stock Exchange under ticker 6920.T and continues to invest in innovation and operational excellence to support its customers’ demands for ever-smaller and more complex semiconductor products. This comprehensive focus on inspection, measurement, and metrology solutions positions Lasertec as a critical supplier to the semiconductor equipment sector, with a commitment to technological advancement and global customer solutions. Recent product launches and strategic partnerships reflect the company’s intent to capitalize on the semiconductor industry’s growth and technological evolution while maintaining a fab-lite R&D-driven model headquartered in Tokyo, Japan.

Company News

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