ULVAC, Inc.

ULVAC, Inc.

53.60
USD
+6.85
(+14.65%)
1.68BMarket Cap
Nov 10Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
3,310.25
3,523.58
3,630.9
3,899.75
4,702.74
5,058.98
4,479.1
3,762.52
3,716.03
4,898.78
4,619.95
5,299.18
5,098.94
- -
Basic EPS, GAAP
-77.15
233.81
179.83
338.39
496.36
728.67
378.77
218.54
301.12
410.38
287.7
410.62
338.74
- -
Free Cash Flow per Basic Share
335.79
540.54
327.19
359.93
634.99
187.06
140.91
201.11
373.06
539.85
-310.67
-55.18
476.29
- -
Dividend per Share
0.02
- -
21.28
9.95
29.96
50.01
95.03
105.02
80.1
95.11
124.16
109.08
144.19
0.02
Book Value per Share
1,120.84
1,365.46
1,608.4
1,477.29
2,002.89
2,994.14
3,062.41
3,132.22
3,388.88
3,837.18
4,024.71
4,478.17
4,538
4,538
Tangible Book Value per Share
1,011.85
1,263.94
1,514.67
1,397.93
1,930.37
2,924.04
2,992.48
3,065.66
3,317.89
3,761.74
3,936.67
4,368.52
4,422.55
4,422.55
Basic Weighted Avg Shares
49
49
49
49
49
49
49
49
49
49
49
49
49
49
Sales/Revenue/Turnover
163,351
173,878
179,174
192,437
231,831
249,271
220,721
185,402
183,011
241,260
227,528
261,115
251,184
- -
Operating Margin (%)
3.74
6.9
6.21
9.28
12.71
14.18
10.8
8.61
9.4
12.46
8.77
11.4
10.56
- -
Depreciation Expense
7,967
7,421
7,630
6,931
6,418
6,541
6,938
7,849
8,386
8,587
8,245
9,181
10,805
- -
Net Income, GAAP
-3,807
11,538
8,874
16,698
24,469
35,904
18,665
10,769
14,830
20,211
14,169
20,233
16,687
- -
Effective Tax Rate (%)
- -
18.55
25.26
2.58
10.28
3.56
26.37
44.44
28.22
26.77
32.05
26.99
32.58
- -
Profit Margin (%)
-2.33
6.64
4.95
8.68
10.55
14.4
8.46
5.81
8.1
8.38
6.23
7.75
6.64
- -
Working Capital
9,508
23,635
30,626
37,466
53,731
73,197
87,461
116,700
124,711
147,085
148,526
162,468
169,422
169,422
LT Debt
24,137
21,012
20,362
23,783
13,220
14,757
21,219
40,576
33,304
32,472
33,117
36,766
35,878
35,878
Total Equity
59,436
72,237
84,928
78,032
104,916
154,070
157,589
161,093
173,699
196,485
204,853
227,957
231,081
231,081
Return on Invested Capital (%)
- -
5.88
4.98
11.1
17.94
19.68
8.95
4.31
5.7
9.54
5.46
8.12
6.34
- -
Return on Capital (%)
- -
7.14
5.47
10.86
16.25
20.62
9.13
4.93
6.77
8.47
5.94
7.29
5.52
- -
Return on Common Equity (%)
-8.24
18.81
12.09
21.93
28.52
29.16
12.51
7.06
9.24
11.36
7.32
9.66
7.51
- -

Capital Structure

JPY

•

in mil. unless spec.
Sep'25
Dec'25
Jun'25
ST Debt
- -
13,027
10,721
LT Borrowings
- -
34,798
32,354
LT Finance Leases
- -
3,141
3,524
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
49
49
49
Market Capitalization
- -
- -
242,370

Working Capital

JPY

•

in mil. unless spec.
Sep'25
Dec'25
Jun'25
Total Current Assets
- -
273,361
270,077
Cash, Cash Equivalents & STI
- -
94,027
105,951
Accounts Receivable, Net
- -
101,515
84,738
Inventories
- -
70,586
71,118
Total Current Liabilities
- -
109,625
100,655
Payables & Accruals
- -
- -
- -
ST Debt
- -
13,027
10,721
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
11.55%
7.57%
1.37%
Free Cash Flow
-103.89%
-214.52%
-962.93%
Net Income, GAAP
16.05%
13.87%
-17.53%
Sales/Revenue/Turnover
4.38%
7.16%
-3.8%
Total Cash Common Dividend
36.05%
9.11%
32.15%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
56,182
55,178
49,599
66,569
227,528
2024
55,038
65,186
64,983
75,908
261,115
2025
- -
- -
- -
- -
251,184

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
82.3
107.23
49.18
49
287.7
2024
23.04
116.2
130.51
140.88
410.62
2025
- -
- -
- -
- -
338.74

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
120.96
2.94
0.22
0.04
124.16
2024
107.01
2.07
0.02
0.02
109.08
2025
- -
- -
- -
- -
144.19

Company Description

CEO
Junya Kiyota
Full Time Employees
5,613
Sector
Electronic technology
Industry
Electronic equipment/Instruments
Address
2500 Hagisono Chigasaki KN Japan 253-8543
IPO Date
Apr 20, 2004
Business
ULVAC, Inc. is a global leader specializing in the development, manufacturing, sales, and comprehensive support for vacuum technology, its diverse peripheral components, and advanced materials across various international markets. The company operates primarily through its Vacuum Equipment and Vacuum Application segments, offering an extensive range of sophisticated machinery. Its core equipment offerings include advanced systems for sputtering, chemical vapor deposition (CVD), vacuum evaporation, and roll-to-roll deposition, alongside solutions for etching, ashing, and ion implantation processes. ULVAC also delivers specialized vacuum furnaces, freeze-drying apparatus, and an array of critical components such as high-performance vacuum pumps—including dry, oil-sealed rotary vane, turbo molecular, and cryopumps—vacuum gauges, leak detectors, and spectroscopic ellipsometers. Furthermore, the company provides sputtering targets, innovative high-performance materials, and nano-metal inks, complementing its core equipment with essential consumables and advanced process technologies. ULVAC's profound expertise is integral to a wide spectrum of industries worldwide, serving key sectors such as semiconductors, flat panel displays (LCD and OLED), solar cells, and advanced electronics manufacturing. Beyond high-tech production, its solutions extend to the automotive, chemical, food processing, and pharmaceutical industries, as well as academic institutions and research facilities. The company’s focus on continuous innovation and R&D ensures its vacuum and deposition technologies remain at the forefront, enabling the creation of next-generation devices and addressing evolving industrial demands. Founded in 1952 and headquartered in Chigasaki, Japan, ULVAC maintains a significant global footprint, providing tailored solutions and extensive technical support to its diverse customer base. Recent activities include strategic movements in its joint ventures and a consistent outlook for profitability despite short-term market fluctuations, underpinned by its role in critical technology supply chains like OLED production and next-generation semiconductor packaging.