Vanchip (Tianjin) Technology Co., Ltd. Class A
SSSE:68815322.23
CNY
-0.51
(-2.24%)
ISIN
CNE1000059G3
Return %
Stock
S&P 500
1Y
-36.90
14.20
3Y
-61.16
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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CNY
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in mil. unless spec.Company Description
- CEO
- Yi Jun Sun
- Full Time Employees
- 592
- Sector
- Producer manufacturing
- Industry
- Electrical products
- Address
- Tianjin China
- IPO Date
- Apr 12, 2022
- Website
- vanchiptech.com
- Similar Companies
- Business
- Vanchip (Tianjin) Technology Co., Ltd. is a fabless semiconductor design company that specializes in the research, development, and sale of radio frequency front-end (RFFE) integrated circuits and high-performance analog chips. Founded in 2010 and headquartered in Tianjin, China, the company provides wireless communication semiconductor solutions for mobile smart terminals, networking equipment, intelligent automotive platforms, and Internet of Things (IoT) devices. Vanchip operates research and development centers, application engineering labs, and sales hubs across key technology centers in China, including Tianjin, Beijing, Shanghai, Shenzhen, and Suzhou, serving top-tier consumer electronics original equipment manufacturers (OEMs) and original design manufacturers (ODMs). The company's core product portfolio encompasses a broad spectrum of radio frequency and mixed-signal components, including cellular radio frequency power amplifier modules such as 5G and 4G multi-mode multi-band power amplifier modules (MMMB PAM), high-integration transmit/receive modules (L-PAMiD and L-PAMiF), and discrete power amplifier integrated circuits; receiver front-end modules, including low-noise amplifier front-end modules (L-FEM), antenna switches, and integrated switch-LNA combinations; discrete radio frequency control components, including radio frequency antenna tuners, high-isolation multi-throw switches, low-noise amplifiers (LNAs), and radio frequency filter/duplexer components; wireless connectivity front-end solutions, comprising Wi-Fi 6, Wi-Fi 6E, and Wi-Fi 7 front-end modules (FEM), Bluetooth front-end modules, and Ultra-Wideband (UWB) modules for smart home, router, and AI edge devices; satellite communication radio frequency front-end chips enabling direct satellite messaging and connectivity on mobile handsets; and automotive-grade radio frequency modules certified under AEC-Q100 standards for in-vehicle infotainment and telematics control units. In recent developments, Vanchip has expanded its high-end product footprint with the mass-market commercialization of its second-generation 5G L-PAMiD modules, including Phase 7LE Plus and Phase 8L series architectures, securing volume deployments across flagship smartphone models produced by major domestic mobile brands. The company has also achieved volume shipment of its next-generation Wi-Fi 7 front-end modules and direct-to-cell satellite communication chips. To strengthen its supply chain security and module integration capabilities, Vanchip executed a strategic investment of CNY 270 million in 2026 to acquire a 33.4 percent equity interest in acoustic filter manufacturer Spectron Technologies, securing proprietary acoustic and Lamb-wave filter capacity for its high-density RF modules. Additionally, the company expanded its communication silicon ecosystem through a late-2025 strategic investment in Nanphi Microelectronics, extending its technical reach into high-speed Ethernet switching silicon and data center networking solutions.