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    Producer manufacturing

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    Electrical products
Hebei Sinopack Electronic Technology Co. Ltd. Class A

Hebei Sinopack Electronic Technology Co. Ltd. Class A

SSZSE:003031
96.15
CNY
+0.22
(+0.23%)
81.32BMarket Cap
Oct 29Next Earn
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
8.42
12.51
13.04
2.7
3.39
3.45
8.59
11.08
5.89
6.39
- -
Basic EPS, GAAP
0.98
1.7
1.88
0.35
0.41
0.41
1.56
2.03
1.2
1.25
- -
Free Cash Flow per Basic Share
-0.32
0.31
-4.59
-0.44
0.12
-0.23
0.82
0.44
0.19
0.99
- -
Dividend per Share
0.18
0.03
0.07
- -
- -
0.09
0.12
0.02
0.29
0.42
- -
Book Value per Share
0.6
0.82
2.22
2.57
3.54
3.86
8.56
12.46
13.38
14.22
14.12
Tangible Book Value per Share
0.59
0.8
2.21
2.52
3.49
3.8
8.04
12.13
13
13.86
13.69
Basic Weighted Avg Shares
27
27
31
218
240
294
292
241
449
450
451
Sales/Revenue/Turnover
231
343
407
590
816
1,014
2,512
2,676
2,648
2,878
- -
Operating Margin (%)
10.98
16.29
15.85
13.87
13.24
11.67
21.56
22.3
23.19
22.93
- -
Depreciation Expense
6
10
14
20
30
41
136
149
183
203
- -
Net Income, GAAP
27
47
59
76
98
122
457
490
539
563
- -
Effective Tax Rate (%)
5.36
6.27
7.63
6.51
3.46
0.3
5.48
7.28
7.84
7.47
- -
Profit Margin (%)
11.6
13.57
14.42
12.94
12.03
12
18.21
18.31
20.36
19.55
- -
Working Capital
47
61
288
223
679
657
1,551
4,257
4,537
4,680
4,228
LT Debt
- -
- -
- -
- -
- -
- -
68
67
11
9
28
Total Equity
133
179
488
564
1,035
1,129
2,905
5,912
6,385
6,814
6,778
Return on Invested Capital (%)
- -
26.52
16.04
13.94
11.95
11.46
25.05
12.46
9.86
9.71
- -
Return on Capital (%)
- -
26.95
16.46
13.91
12.3
11.24
18.68
9.1
7.51
7.35
- -
Return on Common Equity (%)
- -
29.88
17.59
14.53
12.27
11.24
25.17
12.06
9.25
9.04
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
10
11
7
LT Borrowings
- -
- -
- -
LT Finance Leases
9
23
28
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
451
451
451
Market Capitalization
32,999
33,852
81,325

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
5,933
6,352
6,138
Cash, Cash Equivalents & STI
3,776
4,003
3,383
Accounts Receivable, Net
896
1,108
1,253
Inventories
907
902
1,127
Total Current Liabilities
1,253
1,577
1,910
Payables & Accruals
- -
- -
- -
ST Debt
10
11
7
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
56.91%
6.73%
Free Cash Flow
- -
-88.14%
426.61%
Net Income, GAAP
- -
64.3%
4.36%
Sales/Revenue/Turnover
- -
37.23%
8.67%
Total Cash Common Dividend
- -
2,453.56%
46.56%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
548
674
664
762
2,648
2025
614
784
- -
735
2,878
2026
1,099
1,112
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.26
0.29
0.35
0.38
1.2
2025
0.27
0.34
- -
0.26
1.25
2026
0.43
0.46
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.28
- -
- -
0.29
2025
- -
- -
- -
- -
0.42
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Xiang Yang Liang
Full Time Employees
860
Sector
Producer manufacturing
Industry
Electrical products
Address
No. 21, Changsheng Street Shijiazhuang HE China
IPO Date
Jan 4, 2021
Website
sinopack.com.cn
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Business
Hebei Sinopack Electronic Technology Co., Ltd. (003031.SZ) develops, produces and sells electronic ceramic products principally in China and internationally. The company offers optical communication device casings, wireless power device casings, infrared detector casings, high-power laser casings, acoustic surface crystal oscillator casings, 3D optical sensor module casings, 5G communication terminal module casings, aluminum nitride ceramic substrates, ceramic components, integrated heaters and precision ceramic parts; it also provides electronic ceramic materials and components, third-generation semiconductor devices and modules, related technology development and product processing services. These products serve optical communication, wireless communication, industrial laser, consumer electronics, automotive electronics, track transportation, low-carbon heating and cooling, and semiconductor equipment sectors. Founded in 2009 and headquartered in Shijiazhuang, Hebei Province, China, at No. 21 Changsheng Street, Luquan Economic Development Zone, the company operates as a high-tech enterprise controlled by China Electronics Technology Group Corporation's 13th Research Institute. In August 2023, Hebei Sinopack completed the acquisition of a 94.60% stake in Beijing Advanced Semiconductor Innovation Co., Ltd. from multiple sellers including the 13th Institute of China Electronics Technology Group Corporation for approximately CNY 416.30 million, bolstering its semiconductor capabilities; it also finalized the purchase of assets and liabilities related to GaN communication base station RF chip business from the same institute. In 2024, the company announced plans to raise up to CNY 2.5 billion through non-public share issuance to fund acquisitions of equity in Bo Wei and Guolian Wanzhong, targeting expansion in third-generation semiconductors. The firm listed on the Shenzhen Stock Exchange's SME Board in January 2021, previously known as Hebei Sinocera Electronic Technology Co., Ltd.