1. Japan Stocks

  2. •

    Electronic technology

  3. •

    Electronic production equipment
SAMCO, Inc.

SAMCO, Inc.

39.60
EUR
-4.00
(-9.17%)
Dec 14Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
597.21
601.8
746.89
678.41
388.98
680.5
614.48
730.73
715.47
797.05
974.85
1,021.22
- -
- -
Basic EPS, GAAP
50.39
27.06
59.33
44.25
-33.03
50.78
26.84
79.02
94.1
131.09
170.07
183.25
- -
- -
Free Cash Flow per Basic Share
5.65
-44.8
16.17
129.62
17.69
-33.93
98.08
102.69
-35.7
117.9
-25.93
172.62
- -
- -
Dividend per Share
12.5
18
18
16.07
20
15
20
20
25
30
35
45
- -
- -
Book Value per Share
972.02
996.16
1,032.87
1,038.47
995.95
1,030.47
1,030.82
1,093.99
1,171.48
1,252.07
1,387.4
1,531.26
- -
1,567.27
Tangible Book Value per Share
969.25
993.99
1,031.04
1,037.17
994.94
1,028.73
1,028.83
1,092.46
1,170.4
1,251.45
1,386.86
1,528.98
- -
1,565.13
Basic Weighted Avg Shares
7
7
7
8
8
8
8
8
8
8
8
8
8
8
Sales/Revenue/Turnover
4,201
4,233
5,253
5,345
3,125
5,466
4,936
5,870
5,747
6,402
7,831
8,203
- -
- -
Operating Margin (%)
8.15
6.06
12.78
13.93
-8.93
11.68
6.64
15.37
17.22
21.42
23.74
24.59
- -
- -
Depreciation Expense
109
81
78
108
98
118
93
105
95
76
57
83
- -
- -
Net Income, GAAP
355
190
417
349
-265
408
216
635
756
1,053
1,366
1,472
- -
- -
Effective Tax Rate (%)
37.17
34.92
39.44
37.2
- -
27.67
29.33
30.27
27.66
28.92
29.11
29.52
- -
- -
Profit Margin (%)
8.44
4.5
7.94
6.52
-8.49
7.46
4.37
10.81
13.15
16.45
17.45
17.94
- -
- -
Working Capital
4,109
3,972
4,332
5,290
5,054
5,497
5,606
5,998
5,893
6,526
7,500
8,355
- -
8,344
LT Debt
44
22
18
14
10
22
18
9
3
143
103
69
- -
52
Total Equity
6,838
7,007
7,265
8,343
8,001
8,278
8,281
8,788
9,410
10,058
11,144
12,300
- -
12,589
Return on Invested Capital (%)
2.78
2.11
5.03
5.31
- -
5.13
2.55
6.69
7.13
9.07
11.17
10.86
- -
- -
Return on Capital (%)
4.73
2.5
5.28
4.08
- -
4.61
2.42
6.88
7.73
10.02
11.94
11.62
- -
- -
Return on Common Equity (%)
5.29
2.75
5.85
4.47
-3.25
5.01
2.6
7.44
8.31
10.82
12.89
12.56
- -
- -

Capital Structure

JPY

•

in mil. unless spec.
Jul'24
Oct'25
Jan'25
ST Debt
1,042
- -
1,043
LT Borrowings
63
- -
43
LT Finance Leases
6
- -
9
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
8
8
8
Market Capitalization
- -
- -
- -

Working Capital

JPY

•

in mil. unless spec.
Jul'24
Oct'25
Jan'25
Total Current Assets
11,188
- -
11,469
Cash, Cash Equivalents & STI
6,592
- -
5,711
Accounts Receivable, Net
781
- -
2,799
Inventories
2,361
- -
2,768
Total Current Liabilities
2,834
- -
3,125
Payables & Accruals
- -
- -
- -
ST Debt
1,042
- -
1,043
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
- -
Free Cash Flow
- -
- -
- -
Net Income, GAAP
- -
- -
- -
Sales/Revenue/Turnover
- -
- -
- -
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,380
2,725
1,654
2,444
8,203
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
24.24
68.8
28.02
62.2
183.25
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
45
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Osamu Tsuji
Full Time Employees
191
Sector
Electronic technology
Industry
Electronic production equipment
Address
36 Waraya-cho Kyoto KY Japan 612-8443
IPO Date
May 30, 2001
Website
samco.co.jp
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Business
SAMCO Inc. (6387.T) manufactures semiconductor processing equipment specializing in thin-film deposition, etching, microfabrication, cleaning, and surface treatment systems for research and production applications in electronics, optoelectronics, MEMS, power devices, RF devices, quantum computing, and related fields. The company's core products include deposition systems such as plasma-enhanced chemical vapor deposition (PECVD), liquid source CVD (LSCVD), and atomic layer deposition (ALD) systems; etching systems comprising reactive ion etching (RIE), inductively coupled plasma (ICP) etching, silicon deep reactive ion etching (Si-DRIE), xenon difluoride (XeF2), and atomic layer etching (ALE) systems including the RIE-400iP-ALE; and surface treatment equipment such as Aqua Plasma cleaners, plasma cleaners, and UV ozone cleaners. Founded in 1979 and headquartered in Kyoto, Japan, SAMCO operates globally with offices in the United States, Europe (via subsidiary samco-ucp Ltd. in Liechtenstein), Korea, Taiwan, China, Singapore, Malaysia, India, and Australia, serving customers in over 35 countries. Recent developments include a strategic collaboration with Eastern Switzerland University of Applied Sciences (OST) announced in late 2023, providing RIE-10NR and UV-2 systems to OST's cleanroom for European market expansion in compound semiconductor research; the sale of Australia's first RIE-400iP-ALE system to the University of Adelaide in 2025 for III-V semiconductor and photonics advancement; the opening of a new Advanced Technology Development Center in Kyoto with a Class 1,000 cleanroom; and co-hosting Kyoto Day in New Delhi with TOWA Corporation ahead of SEMICON India 2025 to support India's semiconductor industry growth.